General Principle of Reverse Engineering PCB Board

General Principle of Reverse Engineering PCB Board

General Principle of Reverse Engineering PCB Board

When Reverse Engineering PCB Board, electronic components must be line up on the same orientation, through the selection of orientation when PCB board entering soldering wave oven system can decrease or even avoid the inferior soldering phenomenon; according to the expectation that minimum distance between components must be 0.5mm to satisfy the soldering requirement for Reverse Engineering PCB Board, if the space on the PCB is sufficient after Reverse Engineering PCB Board, the distance between the components must be as wide as possible. Refers to the double side PCB Board reverse engineering, the surface mount device side and surface mount component side will be on the composite side;

The notice in the Component Layout:

First we need to ensure the locations of PCB Board with other PCB Board or system interface after Reverse Engineering PCB Board, and must pay attention to the connection point among all other components (such as the orientation of component, etc). Since the size of portable PCB Board is small, the layout of electronic components are very tight after Reverse Engineering PCB Board, consequently those components with big size must be taken into account in priority to confirm their related locations to consider the mutual cooperation issue.

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